IML-P1202 machine is equipped with 12″ super flat lapping plate and can be used as a high precision lapping machine for polishing crystal components, semiconductor wafers, metal, glasses, rocks, minerales, PCB boards, refractory and ceramic substrates up to 4″ in diameter. It can be used as a standard grinding and polishing machine for preparing metallographic samples as well.Combining with flat sample holder (included), the three-hole metallographic sample holder (optional), and precision thinning fixture GPC-80A (optional), the Unipol-1202 can lap and polish various samples automatically.With GPC-80A, it is especially suitable for grinding and polishing geological samples.It can use slurry or abrasive sand paper lapping samples,that all dependes on your sample material.
This equipment is required to be used under the altitude of 1000m, temperature of 25 ℃± 15 ℃ and humidity of 55% Rh ± 10% Rh.
1. Water: The equipment is equipped with water inlet and outlet, which need to be connected with tap water and drainage
2. Electricity: AC220V 50Hz, must be well grounded
3. Gas: None
4. Workbench: size 800mm × 600mm × 700mm, bearing more than 200kg
5. Ventilator: Not required